|
電子組裝材料 SMI代理各式國外知名品牌之電子組裝材料，產品可廣泛應用於汽車電子、一般消費性工業、國防與航太、掌上型裝置、LED產業、綠色環保工業、醫療器械、RFID、無線通訊以及很多其他電子工業領域，SMI為客戶提供全方位的解決方案。 |
焊錫材料/Soldering Paste/Soldering ball /Flux
DanYang Soltec 為韓國ISO 製造商，產品涵蓋錫膏、錫球、錫棒、
助焊劑等。錫粉顆粒大小介於5~45 um；產品標榜以不危害環境與人體為訴求。
擁有世界獨項專利認證，採用各種精密測試儀器控管產品品質，獲得美日韓大廠
的青睞。
Solder Paste
| Model | Flux Type | Alloy | Powder Size | Melting Point | Features |
 | No Clean | 63Sn/37Pb 62Sn/36Pb/2Ag NT4S |
20~45um 20~30um 5~10um | 183°C 179°C1 78~184°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free |
 | Water | 63Sn/37Pb 62Sn/36Pb/2Ag NT4S |
20~45um 20~30um 5~10um | 183°C 179°C1 78~184°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free |
 | No Clean | 96.5Sn/3.0Ag/0.5Cu Sn/1.7Bi/0.8Cu/0.6In (Patent) 42Sn/58Bi |
0~45Bm 20~30Bm | 217~220°C 205~221°C 139°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free ◎ Minimize Flux Carbonization |
 | Water | 96.5Sn/3.0Ag/0.5Cu Sn/1.7Bi/0.8Cu/0.6In (Patent) 42Sn/58Bi |
20~45Bm 20~30Bm | 217~220°C 205~221°C 139°C |
◎ Excellent Wetting Characteristic ◎ No Cleaning Solderpaste ◎ Good Printerability for Fine Pitch ◎ Fast Printing Speed and little adhere ◎ Halide free ◎ Minimize Flux Carbonization ◎ Minimize Flux Carbonization |
Solder Ball
| Model | Flux Type | Alloy | Powder Size | Melting Point | Features |
 | Ball | Sn/Pb Sn/Ag/Cu Sn/Ag/Cu/X Sn/Bi/Cu/In |
762, 630 530, 450 350, 300 250 Bm | 183°C 217~220°C 205~221°C |
◎Excellent Wetting Characteristic ◎Sphere ◎Shiny ◎Many kind of Alloy |
Flux
| Model | Flux Type | Appearance | Solid Contents | S/G (25°C) | Features |
 | No Clean | Pale Yellow | 5.5% | 0.800 Typical | ◎Excellent Surface Wetting ◎Rosin Type ◎Very Little Residue ◎Halide free |
 | No Clean | Clear Colorless | 5% | 1.020 Typical | ◎Excellent Surface Wetting ◎VOC & Halide free ◎Very little Residue ◎Water Soluble ◎Leadfree Application |
 | Water | Gel type amber | - | - | ◎BGA Package Application ◎Excellent Surface Wetting ◎VOC & Halide free ◎Neutrality |
 | No Clean | Gel type amber | - | - | ◎BGA Package Application ◎Excellent Surface Wetting ◎VOC & Halide free ◎Neutrality ◎Water Cleanable |
