Products
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Semiconductor Packaging Materials SMI agent variety of well-known international brands of semiconductor packaging materials, can be widely used in various forms of IC packaging: such as TSOP, TO, QFP, QFN, BGA, CSP-cum-variety of CSP, Flip Chip packaging and so on. Can also be used in the tantalum capacitor, memory cards and other related products. |
Other semiconductor packaging materials such as: COB Encapsulants : Dam & Fill ,Glob Tops, Underfill.. etc.
For more information, please contact us on +886-2-2758-0920
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